Key Role:

Provide technical leadership and subject matter expertise to defense clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, BGA, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define strategies and technology assessment methods to enable shared understanding of defense packaging objectives, testing and evaluation of those technologies, and develop roadmaps, business models, and technology models for improved access and collaboration in the future.

Basic Qualifications:

• 5+ years of experience with hands on engineering, including microelectronics packaging technologies
• 2+ years of experience with the design and analyses of various electronic packaging failure modes in temperature cycling, shock, and vibration test conditions
• Experience with one or more packaging-related structural, thermal, materials, or related modeling toolkits, including ABAQUS, COMSOL, SOLIDWORKS, material testing for mechanical characterization, reliability testing methods, or data analyses
• Knowledge of various new packaging architectures, including multi-chip, chip on-chip, chip on the wafer, and package architecture assembly and reliability challenges
• Knowledge of the types of packaging used today and the gaps in today’s technologies and approaches, ongoing research in advanced packaging, what promising efforts are underway, and their respective goals and timelines
• Knowledge of microelectronics packaging performance parameters
• Ability to perform analytical calculations of packaging performance, provide accurate technical assessment of various approaches, and incorporate these into technology roadmaps to guide industry activities
• Ability to understand defense needs related to advanced microelectronics packaging, evaluate the performance of various technologies and vendors, and define a technology and business roadmap that defines the path forward to senior stakeholders
• Secret clearance
• BA or BS degree in Engineering or Materials Science

Clearance:

Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information; Secret clearance is required.

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